CY-3310 Precision Slicing Machine

Product Overview

The CY-3310 Precision Dicing Saw is equipped with an imported air-bearing spindle, offering exceptional precision, rigidity, high output power, low noise, and long service life. The spindle speed is user-configurable, with real-time monitoring of operational status. All XYZ axes utilize imported linear guides and ball screws. The Y-axis features full-closed loop grating control combined with mathematical model fitting, ensuring superior precision.

The system is controlled by an industrial-grade computer with real-time state monitoring and a 15-inch industrial-grade LCD touchscreen for all operations. Its self-guided programming mode supports multiple programmable process schemes to accommodate a wide variety of materials and cutting modes.

The microscope includes an auto-focus function, with options to switch between ring light and coaxial light. Workpiece alignment is streamlined through direct image clicking, significantly increasing efficiency. All water-contacting surfaces are made of stainless steel, and the fully enclosed waterproof design prevents coolant splashes and water mist leakage, maintaining a clean working environment.

The cutting chamber features an automatic locking mechanism, along with multiple safety measures and alerts for compressed air, coolant, and power, ensuring safe and reliable operation.

Product Features

Large Cutting Capacity: Maximum processing size of φ12.

Imported Air-Bearing Spindle: Standard configuration includes a high-torque 2.4KW spindle.

Optional Advanced Features:

Non-Contact Height Sensor (NCS)

Blade Breakage Detection (BBD)

High-Precision θ Axis: Direct-drive DD motor for enhanced precision and speed.

Dual Microscope Systems: Includes high and low magnification systems for fast image recognition, multiple alignment modes, edge-finding, and significantly improved efficiency.

Purchase Information

If you are interested in our precision dicing saw, please contact us for more details and pricing.

Phone: +86 18516380382

Email: Jimmy@cysitech.com

Contact Person: Jimmy Hao

WeChat: +86 18516380382

Technical Parameters

Main components：

Application Fields

Semiconductor Industry: Used for dicing semiconductor wafers into individual chips from larger wafers.

Solar Panels: Cutting solar panels to meet different size requirements.

Electronic Component Manufacturing: For cutting various small electronic components, such as sensors and LEDs.

Optical Component Processing: Precision cutting of optical materials like laser glass and lenses.

Application Example: "Dicing a 6-Inch Wafer Using a Dicing and Cutting Machine"

Process Steps

1. Wafer Preparation

Cleaning: Thoroughly clean the 6-inch wafer before cutting to remove dust, impurities, and any substances that may affect the cutting quality. Common cleaning methods include ultrasonic cleaning and chemical cleaning.

Inspection: Check the wafer for visible defects (e.g., cracks or scratches) to ensure the material quality meets cutting requirements.

2. Positioning and Installation

Wafer Installation: Place the cleaned wafer on the dicing machine’s cutting table, typically secured using a vacuum suction system to prevent movement during cutting.

Precise Alignment: Use an automatic alignment system or laser positioning device to ensure accurate alignment of the wafer. Proper alignment is crucial to ensure that chip positions match the design specifications during the cutting process.

3. Cutting Plan Design

Path Setting: Use computer-aided design (CAD) software or the dicing machine’s control system to plan the cutting path. The path is optimized based on the wafer design requirements, including chip size, spacing, and cutting sequence.

Parameter Configuration: Set cutting parameters such as cutting speed, depth, blade type, and coolant flow rate to ensure quality and efficiency.

4. Blade Selection and Installation

Blade Selection: Choose a suitable blade, such as a diamond blade or another hard-material blade. Diamond blades are often used for semiconductor wafers due to their high hardness, ensuring cutting precision and quality.

Blade Installation: Mount the cutting blade onto the dicing machine’s spindle, ensuring it is securely installed for high-speed rotation.

5. Cutting Process

Start Cutting: Once all settings are complete, start the dicing machine. The blade rotates at the preset speed and cuts along the predefined path.

Depth Control: Adjust the blade’s cutting depth based on the wafer thickness, typically 50%-70% of the wafer’s thickness, to ensure smooth cutting.

Cooling System: Use coolant (usually water or water-based coolant) to spray onto the cutting area during the process. This reduces heat generation and minimizes blade wear.

6. Post-Cutting Processing

Quality Inspection: Perform an initial inspection of the diced chips to ensure cutting quality. Check for chip dimensions, edge smoothness, cracks, and burrs.

Cleaning: Clean the wafer and chips again to remove debris and coolant residues from the cutting process.

Drying: Dry the cleaned wafer and chips to avoid moisture affecting subsequent processes.

7. Follow-Up Processes (Optional)

Packaging and Storage: Diced chips are typically packaged to prevent damage or contamination. Packaging can range from encapsulated chips to bare die packaging.

Testing and Sorting: Some chips may undergo testing to ensure their electrical performance meets requirements. Chips that fail testing are sorted and discarded.

8. Quality Control and Recordkeeping

Quality Inspection: Conduct comprehensive quality checks on diced chips, including dimensional accuracy, surface quality, and electrical performance.

Documentation and Traceability: Record cutting parameters, quality control data, and product inspection results for future traceability and quality management.

Key Considerations During the Cutting Process

Cutting Speed and Pressure: Avoid excessive cutting speed to prevent surface or edge cracks on the wafer. Control the cutting pressure carefully to ensure smooth cutting.

Coolant Flow Rate: Maintain sufficient coolant flow to reduce heat generation and prevent thermal damage to the wafer.

Blade Wear: Regularly inspect blade wear and replace blades as needed to maintain cutting precision and efficiency.

Chip Spacing: Precisely control the spacing between chips during cutting. Excessive spacing wastes wafer material, while insufficient spacing may lead to weak connections between chips.