CY-UV800 De-bonding Machine

The de-bonding machine is designed for the removal of UV adhesive used in products such as wafers, QFNs, glass, substrates, phone modules, and ceramics after cutting. This series features an LED cold light source and utilizes an editable controller with a full-color touchscreen for operation, offering improved performance stability and ease of use.

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Product Features

Wide Application: Suitable for blue film, UV film, PET substrate films, and other single/double-layer films.

LED Cold Light Source: More stable and provides more uniform irradiation compared to mercury lamps.

Cold Light Source: 180° flat irradiation with scanning light exposure, gradually weakening and eliminating the UV adhesive's stickiness.

Compact Desktop Design: Occupies minimal space.

Reliable Electrical Components: Uses trusted brands like Omron and Siemens for safe, reliable performance.

Drawer System: The LED light source turns off when the drawer is opened.

Touchscreen Interface: Small touchscreen for easy parameter setting and error alerts.

One-Button Automatic Workflow: Start the full automated process with a single button.

Long Life Cold Light Source: The lifespan is 10 times longer than standard mercury lamps, capable of continuous operation for over 6000 hours.

Hydraulic Spring Support: The top cover is supported by a hydraulic spring for easy, safe operation.

Purchase Information

If you are interested in our de-bonding machine, please feel free to contact us for more information and pricing.

Phone: +86 18516380382

Email: Jimmy@cysitech.com

Contact Person: Jimmy Hao

WeChat: +86 18516380382

WhatsApp: +86 13939946898

Technical Parameters

Parameter name	Parameter description
Product name	Glue dissolving machine
Product model	CY-UV800
Working voltage	AC220V, 2.0KW
Suitable size	8 inches and below
Light source	Ultraviolet, wavelength 365nm
Applicable film	0.1-0.17mm
Light source distance	About 30mm from Frame
Degumming time	Can be set