E-mail: cysi@cysi.wang
Laboratory low-speed diamond cutting machine is especially suitable for cutting or sliting materials, can also cut a certain Angle of the sample, spindle rotation is adjustable, the cutting process depends on the micrometer to adjust the size of the cut sample, the size control is accurate. The laboratory crystal low speed diamond cutting machine is equipped with cutting limit protection, which can ensure that the fixture is not cut by the saw blade. It is a CE certified cutting equipment, suitable for the precision cutting of material analysis samples, such as all kinds of crystals (sapphire, garnet, etc.), ceramics, cement, glass, rock samples, mineral samples, metal, plastic, PCB board, medical materials, dental materials, refractory materials, building materials, composite materials and organic polymer materials.
1. CY-DS-100 low-speed diamond cutting machine is especially suitable for cutting or slicing materials, and can also cut samples at a certain Angle. The spindle revolution is adjustable. The machine is equipped with cutting limit protection, which can ensure that the fixture is not cut by the saw blade.
2. CY-DS-100 low-speed diamond cutting machine can change different cutting blades according to different types of materials to be cut (such as sintered diamond blades, electroplated diamond blades, corundum saw blades, silicon carbide saw blades, cubic boron nitride saw blades). There is a cooling water box under the saw blade, and the cooling liquid in the box is brought to the sample by the rotation of the saw blade. The heat generated during the cutting process is taken away in time to prevent the sample from changing its tissue due to heat.
3. CY-DS-100 low-speed diamond cutting machine is small in size and easy to operate, and is an indispensable cutting equipment for material researchers.
If you are interested in our Low speed diamond cutting machine, please contact us for more information and a quote.
Contact number: +8615617875939
E-mail: gordon@zztainuo.com
Contact: Gordon Zhang
Wechat: 15617875939
WhatsApp: +8613592553141
Product name | Low speed diamond cutting machine |
Product model | CY-DS-100 |
Installation condition | 1. Temperature and humidity: 10-85%RH (at 25℃ no condensation) Temperature: 0-45℃. 2. There is no strong source and corrosive gas around the equipment. 3. Power supply: National standard three-pole socket AC100~240V 50/60Hz 10A must have a good grounding cable |
Main parameter
| 1. Power supply voltage: DC24V 6.67A (standard "power adapter") 2. Drive motor power: 50W 3. Spindle speed (effective value) : speed min~max: 25~600rpm 4. Differential head: mechanical 5. Slide seat feed stroke max: 50mm 6. Slide fine-tuning stroke: 25 (accuracy 0.01) mm machinery 7. Saw blade size: Φ76~Φ100×Φ12.7mm 8. Cutting depth max: 25mm 9. Two-dimensional fixture Horizontal Angle: 360° Tilt Angle: ±15° 10. Load block size: 25×50mm 11. Jaws of the pliers: 25mm 12. Product specifications · Size: 370×330×330mm · Weight: 12kg |
Note: 1. The power supply of the device is the national standard single-phase AC 220V 50Hz. The actual power supply parameters are subject to the label affixed to the rear of the product. 2. Can be customized according to user requirements all kinds of grinding disc, special loading sample plate, fixture, special parts and so on. | |
Serial number | Name | Quantity |
1 | Adjustable 2D fixture | 1set |
2 | Vice | 1piece |
3 | Drive motor belt | 2pcs |
4 | Saw clamping pad (Ø62mm, Ø48mm, Ø35mm) | 1 set |
5 | Resin-ceramic block (50mm×50mm×10mm) | 1pcs |
6 | Fully sintered diamond saw blade (Ø100mm×Ø12.7mm×0.33mm) | 1piece |
7 | Electroplated diamond saw blade (Ø100mm×Ø12.7mm×0.5mm) | 2pcs |
8 | Silicon carbide saw blade (Ø100mm×Ø12.7mm×0.4mm) | 4pcs |
9 | Corundum saw blade (Ø100mm×Ø12.7mm×0.4mm) | 4pcs |
10 | Paraffin stick | 3 roots |
11 | Power cord | 1 root |
The application field of low-speed diamond cutting machine is very wide, mainly including the following aspects:
1. Precision cutting of material analysis samples : Suitable for all kinds of crystals (such as sapphire, garnet, etc.), ceramics, cement, glass, rock samples, mineral samples, metal, plastic, PCB board, medical materials, dental materials, refractory materials, building materials, composite materials and organic polymer materials.
2. Construction field : Diamond wire cutting in the construction field is widely used in the processing of marble, granite and other hard building materials, its accuracy and efficiency make it easy to cut complex shapes.
3. In the field of art : diamond wire cutting technology in the field of art also has an excellent application, artists can use this technology in a variety of materials to achieve exquisite engraving, showing a delicate artistic expression.
4. Glass processing field : Diamond wire cutting also shines in the field of glass processing, its precision cutting characteristics make glass processing more fine, widely used in the production of glass art, precision instruments and other fields.
5. Semiconductor industry : Diamond wire cutting machine plays an important role in the field of semiconductor manufacturing, used for cutting, cutting and slicing silicon wafers.
6. Photovoltaic industry : Diamond wire cutting machine is one of the largest application areas of photovoltaic industry, used for cutting hard and brittle materials such as photovoltaic silicon wafers and sapphire.
7. Research institutes and universities : Low-speed diamond cutting machine is the ideal sample making equipment for research institutes, universities and industrial and mining enterprise laboratories, which is used for precision cutting of material analysis samples.
8. Environmental protection, geology and mining, building materials, metallurgy : SYJ-150 type low-speed diamond cutting machine is also suitable for environmental protection, geology and mining, building materials, metallurgy and other fields of sample cutting.
These application areas show the versatility and importance of low-speed diamond cutting machines in industry and scientific research.
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