Lab 12 inches automatic diamond wire saw system

Product introduction:

The automatic diamond wire cutting machine is suitable for cutting materials with different hardness, such as ceramics, crystals, glass, metals, rocks, thermoelectric materials, infrared optical materials, composite materials and biomedical materials. It is mainly used for processing large-sized precious materials, and the cutting size can reach 12".

Product overview:

CY-DWC-M1212 automatic diamond wire cutting machine is especially suitable for cutting large size samples. It can also be used for the cutting of seed crystals of silicon, white gems, sapphire and other artificial crystal materials, as well as the square cutting of silicon crystals and sapphire crystals. When used in the section of precious stones and bioplasticized specimens, not only the slit is fine, but also the quality of the cut piece is excellent, which greatly improves the utilization rate of the material.

Automatic diamond wire cutting machine is a continuous cutting diamond wire cutting machine, set the cutting program after the sample continuous feed, no manual adjustment, the sample size accuracy after cutting is high, in the range of ±10μm.

The cutting line of CY-DWC-M1212 automatic diamond wire cutting machine adopts the circulating motion mode of a single line, the length of the line can be used is long (≤150m), and the service life of a line is long, which greatly improves the cutting efficiency.

Product Features

Cutting size up to 12". (max)

The main motor drives the diamond cutting line to move down at a constant speed, and the material is fixed on the workbench to ensure the stability of cutting.

 The table can be manually or through program control for 360° rotation adjustment.

 The use of pneumatic tensioning system, the use of imported pneumatic components, making the tensioning force more stable and reliable.

PLC program control system and large size touch screen, make the operation simple and fast.

According to your needs to design a variety of tooling fixture.

Purchase Information

If you are interested in our Lab 12 inches precision diamond wire saw , please feel free to contact us for more information and price.

Contact phone number: 183-3926-3857

Email: jack@cysitech.com

Contact person: Jack Yang

WeChat: 183 3926 3857

Product parameter:  

Standard parts：

Application Fields of Lab 12 inches automatic precision diamond wire cutting machine

1. Crystal and material cutting: suitable for all kinds of crystals and substrates without damage cutting, such as magnesium oxide crystals, shale slices, infrared optical materials (zinc selenide, zinc sulfide, silicon, germanium and other crystals).

2. Ceramic industry: Diamond wire cutting machine is widely used in the ceramic industry, and can be used for cutting ceramic bricks, sanitary ceramics and other products.

3. Glass processing: For high-precision cutting needs such as flat glass and optical glass, diamond wire cutting machine also performs well.

4. Gem processing: The high precision and high efficiency of the diamond wire cutting machine make it the ideal choice for the gem processing industry.

5. The field of new materials: With the continuous development of the field of new materials, the application of diamond wire cutting machine in composite materials, nanomaterials and other fields is also expanding.

6.Photovoltaic silicon cutting: diamond wire cutting machine is mainly used to cut a variety of hard and brittle materials, such as photovoltaic silicon, semiconductor silicon and so on.

7. Stone processing: In the stone processing industry, diamond wire cutting machine also plays an important role, can be used for marble, granite and other stone cutting.

8. Semiconductor material cutting: diamond wire cutting machine also has important applications in the semiconductor industry, which can cut semiconductor materials such as silicon wafers and silicon carbide.

9. Other fields: In addition to the above fields, diamond wire cutting machine is also widely used in dental materials, biological and bionic composite materials, PCB board and other materials cutting.