Lab 2 inches precision diamond wire saw system

Product introduction:

The 2 inches precision diamond wire cutting machine is an ideal tool for cutting fragile, brittle, small volume materials. Diamond-embedded wire saws are especially suitable for non-damaging cutting of various crystals and substrates.

Product overview:

The 2 inches precision diamond wire cutting machine is mainly used for cutting all kinds of crystals and substrates, especially for non-damaging cutting. This device uses diamond-embedded wire saws for cutting and is suitable for a variety of materials, including ceramics, crystals, glass, metals, rocks, thermoelectric materials, infrared optical materials, composite materials, and biomedical materials.

Product Features

1. High-precision cutting: The equipment can achieve high-precision Angle and position control to ensure the accuracy of the cutting surface.

2. A wide range of material adaptability: suitable for cutting a variety of materials, including but not limited to crystals, ceramics, glass, metal, etc.

3. Easy operation: The equipment usually has an intuitive operation interface, making the operation process simple and convenient.

4. Space saving: The equipment covers a small area, saves space, and is convenient and flexible to move.

5. Low noise: In the operation process, the noise generated by the equipment is small, suitable for laboratory and research environment.

6. Cutting line speed control: The equipment can control the speed of the cutting line to adapt to different cutting needs.

7. Cutting line tension adjustment: with cutting line tension adjustment device, to achieve accurate cutting.

8. Gravity feed method: gravity feed method is used when cutting the sample, and the cutting speed of the sample is related to the rotation speed of the ring diamond line, but also related to the weight of the force.

9. Environmental protection and energy saving: low heat output during equipment operation, reducing energy consumption and material loss.

Purchase Information

If you are interested in our Lab 2 inches precision diamond wire machine, please feel free to contact us for more information and price.

Contact phone number: 183-3926-3857

Email: jack@cysitech.com

Contact person: Jack Yang

WeChat: 183 3926 3857 

Detailed Parameter：

Standard parts：

Application Fields of Lab 2 inches precision diamond wire cutting machine

1. Crystal and material cutting: suitable for all kinds of crystals and substrates without damage cutting, such as magnesium oxide crystals, shale slices, infrared optical materials (zinc selenide, zinc sulfide, silicon, germanium and other crystals).

2. Ceramic industry: Diamond wire cutting machine is widely used in the ceramic industry, and can be used for cutting ceramic bricks, sanitary ceramics and other products.

3. Glass processing: For high-precision cutting needs such as flat glass and optical glass, diamond wire cutting machine also performs well.

4. Gem processing: The high precision and high efficiency of the diamond wire cutting machine make it the ideal choice for the gem processing industry.

5. The field of new materials: With the continuous development of the field of new materials, the application of diamond wire cutting machine in composite materials, nanomaterials and other fields is also expanding.

6.Photovoltaic silicon cutting: diamond wire cutting machine is mainly used to cut a variety of hard and brittle materials, such as photovoltaic silicon, semiconductor silicon and so on.

7. Stone processing: In the stone processing industry, diamond wire cutting machine also plays an important role, can be used for marble, granite and other stone cutting.

8. Semiconductor material cutting: diamond wire cutting machine also has important applications in the semiconductor industry, which can cut semiconductor materials such as silicon wafers and silicon carbide.

9. Other fields: In addition to the above fields, diamond wire cutting machine is also widely used in dental materials, biological and bionic composite materials, PCB board and other materials cutting.