Open laser cutting machine

Brief introduction:

The open laser cutting machine is an advanced metal processing equipment known for its efficient and precise cutting capabilities. The machine adopts open design, which makes the operation more convenient and the maintenance more simple. Its wide cutting range can meet the cutting needs of various metal materials. In addition, the machine is equipped with an intelligent control system that enables high-precision, high-speed cutting while maintaining low energy consumption. Open laser cutting machine is widely used in automotive, aviation, electrical appliances and other manufacturing fields, is one of the indispensable important equipment in modern industrial production. Its excellent performance and stable operation have won the trust and praise of the majority of users.

Application Industry:

Rail transit, ship manufacturing, automobile, engineering machinery, agriculture and forestry machinery, electrical manufacturing, elevator manufacturing, household appliances, grain machinery, textile machinery, tool processing, petroleum machinery, food machinery, kitchen and sanitary ware, decorative advertising, laser external processing services and other machinery manufacturing and processing industries.

Applicable materials:

Carbon steel, stainless steel, aluminum alloy, brass, copper, pickling plate, galvanized plate, silicon steel plate, electrolytic plate, titanium alloy, manganese alloy and other metal materials.

Contact information

If you are interested in our products, please contact us for more information and a quote.

Phone：+86 136 6380 8508

Email：jason@cysitech.com

Sales manger：Jason.Zhang

WhatsApp:+86 150 3827 2566

Wechat：cykytech

Technical parameters

Application case

Precision electronic components processing

Equipment preparation:

Place the laser cutting machine in a clean, dry and compliant workshop environment, ensure a stable power supply, connect the cooling system pipeline (if it is a water-cooled model), and connect the compressed air source.

Turn on the general power switch of the device, wait for the self-test of the control system to be completed, and observe the indicators on the control panel to ensure that key components such as the laser generator, motion motor, and optical transmission system are normal and ready, and there is no fault warning.

According to the material characteristics of the electronic components to be processed (such as common copper-clad plates, ceramic substrates, etc.), the corresponding cutting parameter templates are selected from the built-in material library of the control system. These templates preset key parameters such as laser wavelength, power, pulse frequency, etc., to ensure that the initial cutting conditions are accurately matched. When encountering special new materials, technicians fine-tune the parameters according to the material characteristics manual and past experience.

Material loading:

Take the prepared electronic component raw material sheet out of the ESD storage cabinet. The size of the sheet is usually within the specified size range (for example, less than 300mm x 300mm). Use a dust-free cloth dipped in appropriate detergent to gently wipe the surface of the sheet to remove dust, oil, and other impurities.

The clean sheet is carefully placed on the cutting machine workbench, and the sheet is accurately fixed by the precision positioning block and the vacuum adsorption device on both sides of the workbench. The vacuum adsorption device can ensure that the plate does not move during the cutting process, and the positioning accuracy is controlled within ±0.05mm to ensure the accuracy of the starting position of the cutting.

Cutting operation:

Open the designed electronic component cutting graphics file on the operation control terminal of the device, which is generally generated by professional CAD/CAM software and imported in a general format such as.DXF. Operators carefully check key information such as graphic path and size to ensure consistency with product design requirements.

After confirmation, click the "Start cutting" button and the device will start immediately. Advanced laser technology comes into play, and the laser beam is focused to a tiny spot by a high-precision optical focusing system, and the diameter of the spot can be accurately controlled in the tens of microns. At the same time, the precision motion control system drives the cutting head along the preset path at high speed and smooth movement, and the cutting speed is dynamically adjusted according to the complexity of the material and the pattern, generally between tens of millimeters to hundreds of millimeters per second.

During the cutting process, the intelligent monitoring system of the equipment monitors the laser power, temperature, cutting head position and other parameters in real time. In case of abnormal fluctuations (such as laser power attenuation and high temperature), the cutting is automatically suspended and an alarm is issued, prompting the operator to troubleshoot the fault.

Cutting and quality inspection:

When all cutting tasks are successfully completed, the cutting head automatically returns to the position, and the vacuum adsorption and laser system stop working. The operator carefully unfixes the plate, uses antistatic tweezers to remove the cut electronic components one by one, and places them in a special detection tray to avoid damage due to static electricity or collision.

Then, the dimensional accuracy, edge flatness and notch quality of electronic components are tested comprehensively by using high-precision microscopes, quadratic image measuring instruments and other professional testing equipment. For example, for the cutting of small pins, the dimensional tolerance is required to be controlled within ±0.02mm, and the incision roughness Ra needs to be less than 1.6μm. Record the unqualified products in detail, and adjust the cutting process parameters retrospectively according to the test results to ensure the stability of the subsequent production quality.